If you are looking for testing equipment such as probe cards and IC sockets, you have come to the right place!

Conventional Kelvin measurement probe card which used Pogo-Pin, could not narrow a gap between force and senses pin.
Therefore a tip of pins was slippery to the edge of Ball, and it was not caught the center of PAD and was not able to get a stable contact.
The convenience of conventional Pogo-Pin was just similar, and the new model Kelvin Probe Card of Seiken was able to narrow a gap of the pin future to 60um.
By this technology, it can get a stable contact for the extremely small bump and pad.

It is Probe Card which can support multi-DUT inspection of TCP and COF easily by using vertical probe.
This contributes to the reduction of the running cost so that pin exchange every one pin

We have extended our contact technology for solder balls gained over many years in IC sockets for WL-CSP testing to our probe cards as well. Using our proprietary tip coating, this probe card is able to keep solder adhesion to a minimum for reliable testing. In addition, it is possible to do not only single contact but also Kelvin contact. We apply our know-how as an IC socket and probe card manufacturer to meet the diversified needs of our customers.

Our microcube promises stable contact with the ever narrowing electrode pitch resulting from higher and higher device performance. Our microcube is a ceramic block type vertical probe card that has a proprietary shaped tip. Thanks to our proprietary contact tip and microfabrication technology we can handle pitches as narrow as 45 ?m. Our microcube not only can handle narrow pitches, but is also able to minimize damage to the pad using a much smaller dent than that compared to cantilever probe cards.

Using our unique alloy on a contact tip, alloy probes have improved the contact performance and the life span markedly, compared to surface treatment of traditional plating. Tip shapes of R, flat, needle and crown are available.