| Product Name | IC Socket |
|---|---|---|
| ApplicationPurpose | BGA, SCP, QFP, et al. | |
| Description | Using our lead-free, proprietary tip coating, we are able to keep solder adhesion to a minimum for reliable testing. In addition, it is possible to do not only single contact but also Kelvin contact. |
| Product Name | TCP/COF Socket |
|---|---|---|
| ApplicationPurpose | TCP and COF | |
| Description | This socket incorporates our proprietary chip-less pin construction to handle narrow pitches. This chip-less pin is a structure that doesn't have a pipe with a tip for the proprietary spring. This makes it able to handle with high density test heads. In addition, the proprietary spring not only handles narrow pitches but has also realized a long life of 1 million cycles. |
| Product Name | High Frequency Socket |
|---|---|---|
| ApplicationPurpose | High Frequency devices such as CSP, QFN, QFP and modules | |
| Description | By changing the tip shape and surface treatment flexibly、contact probe |
| Product Name | Alloy probes |
|---|---|---|
| ApplicationPurpose | The contact to lead-free solder balls such as CSP, BGA | |
| Description | Using our unique alloy on a contact tip, alloy probes have improved the contact performance and the life span markedly, compared to surface treatment of traditional plating. Tip shapes of R, flat, needle and crown are available. |