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IC Sockets

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Product Name IC Socket
ApplicationPurpose BGA, SCP, QFP, et al.
Description

Using our lead-free, proprietary tip coating, we are able to keep solder adhesion to a minimum for reliable testing. In addition, it is possible to do not only single contact but also Kelvin contact.

Detail

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Product Name TCP/COF Socket
ApplicationPurpose TCP and COF
Description

This socket incorporates our proprietary chip-less pin construction to handle narrow pitches. This chip-less pin is a structure that doesn't have a pipe with a tip for the proprietary spring. This makes it able to handle with high density test heads. In addition, the proprietary spring not only handles narrow pitches but has also realized a long life of 1 million cycles.

Detail

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Product Name High Frequency Socket
ApplicationPurpose High Frequency devices such as CSP, QFN, QFP and modules
Description

By changing the tip shape and surface treatment flexibly、contact probe 
has the benefits of steady contact and unlimited pin arrangement
depending on various semiconductor packages such as LGA and BGA.
But because of it's length, it has been believed that contact probe could be
used successfully in low frequency applications.
SEIKEN has unique precision manufacturing and assembly technology while
maintaining its traditional probe pin shape, we have realized extra-short pin
With a total length of 1.5mm.
You can use it in the same way as typical probe IC sockets in the semiconductor
test world, which makes it possible to use for high frequency devices.

Detail

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Product Name Alloy probes
ApplicationPurpose The contact to lead-free solder balls such as CSP, BGA
Description

Using our unique alloy on a contact tip, alloy probes have improved the contact performance and the life span markedly, compared to surface treatment of traditional plating. Tip shapes of R, flat, needle and crown are available.

Detail