{"id":103,"date":"2025-07-25T11:12:50","date_gmt":"2025-07-25T02:12:50","guid":{"rendered":"https:\/\/www.seiken.co.jp\/english\/wp\/?page_id=103"},"modified":"2025-07-29T10:07:39","modified_gmt":"2025-07-29T01:07:39","slug":"fine_pitch","status":"publish","type":"page","link":"https:\/\/www.seiken.co.jp\/english\/products\/probe\/fine_pitch\/","title":{"rendered":"Fine-Pitch Technology"},"content":{"rendered":"<section id=\"about\" class=\"container\">\n<h2>Innovative Solutions for Advanced Test Environments<\/h2>\n<div class=\"column2 -img2\">\n<div class=\"txt_wrap\">\n<p>\n              In semiconductor testing, cantilever probes are typically used for wafer-level inspection, while IC socket methods using double-ended probes are common packaging testing. However, as chip mounting technology evolves, more devices now feature fine-pitch bumps or copper pillars directly on the chip, making traditional cantilever methods less effective. The extremely tight, grid-like bump layouts make it difficult to position probe tips accurately.<br \/>\n              <br \/>At the same time, the demand for simultaneous multi-device testing with uniform and fine-pitch contact is increasing. This has led to the growing use of vertical probe cards and other high-density testing solutions. Seiken addresses these challenges by offering fine-pitch probes tailored to your pitch requirements, along with customized fixtures and board designs, delivering a total solution for advanced test needs.\n            <\/p>\n<\/p><\/div>\n<div class=\"img_wrap column2\">\n<figure>\n              <img decoding=\"async\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/themes\/wp-seiken-en\/assets\/images\/products\/probe\/fine_pitch\/about_img01.jpg\" alt=\"Fine-Pitch Technology\"><br \/>\n            <\/figure>\n<figure>\n              <img decoding=\"async\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/themes\/wp-seiken-en\/assets\/images\/products\/probe\/fine_pitch\/about_img02.jpg\" alt=\"Fine-Pitch Technology\"><figcaption>Size Comparison:Probe vs 0.5 mm Lead<\/figcaption><\/figure>\n<\/p><\/div>\n<\/p><\/div>\n<\/section>\n<div class=\"anchor\">\n<ul class=\"anchor_list container\">\n<li><a href=\"#feature\">Key Features &#038; Advantages<\/a><\/li>\n<li><a href=\"#usage\">Application Examples<\/a><\/li>\n<li><a href=\"#cases\">Custom solution examples<\/a><\/li>\n<li><a href=\"#related_products\">Related Products<\/a><\/li>\n<\/ul><\/div>\n<section id=\"feature\" class=\"container\">\n<h2>Key Features &#038; Advantages<\/h2>\n<div class=\"box -border\">\n<h3>01 Flexible solutions for diverse test environments<\/h3>\n<p>Seiken\u2019s fine-pitch probes support pitches as small as 130\u00b5m. Combined with vertical probe cards, IC sockets, and other test fixtures, they ensure reliable contact with tightly arranged micro bumps, adapting to a wide range of testing environments.<\/p>\n<\/p><\/div>\n<div class=\"box -border\">\n<h3>02 Stable contact with micro bumps<\/h3>\n<p>We use special alloys with excellent solder affinity for the probe tip and support custom tip shapes such as crown cuts. This ensures stable and reliable contact, even with small bumps.<\/p>\n<\/p><\/div>\n<div class=\"box -border\">\n<h3>03 Enhanced connectivity powered our unique spring mechanism<\/h3>\n<p>Seiken&#8217;s unique spring structure delivers consistent contact force and outperforms conventional single-pitch probe springs. This enhances contact reliability and boosts test accuracy, even under demanding conditions.<\/p>\n<\/p><\/div>\n<\/section>\n<section id=\"usage\" class=\"container\">\n<div class=\"ttl_link\">\n<h2>Application Examples<\/h2>\n<p>          <a href=\"..\/..\/industry_category\/\" class=\"link\"><span>Explore more <\/span><\/a>\n        <\/div>\n<div class=\"column2\">\n<figure class=\"-border\">\n<div><img decoding=\"async\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/themes\/wp-seiken-en\/assets\/images\/products\/probe\/fine_pitch\/usage_img01.jpg\" alt=\"\"><\/div>\n<\/figure>\n<div class=\"txt_wrap\">\n<ul class=\"list -dotted\">\n<li>Wafer-level testing<\/li>\n<li>FPD (Flat Panel Display) inspection<\/li>\n<li>Electronic component testing<\/li>\n<\/ul><\/div>\n<\/p><\/div>\n<\/section>\n","protected":false},"excerpt":{"rendered":"<p>Innovative Solutions for Advanced Test Environments In semiconductor testing, cantilever probes are typically  [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":39,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"page-products-child.php","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-103","page","type-page","status-publish","hentry"],"aioseo_notices":[],"acf":[],"_links":{"self":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/pages\/103","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/comments?post=103"}],"version-history":[{"count":0,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/pages\/103\/revisions"}],"up":[{"embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/pages\/39"}],"wp:attachment":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/media?parent=103"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}