{"id":148,"date":"2025-07-25T13:00:55","date_gmt":"2025-07-25T04:00:55","guid":{"rendered":"https:\/\/www.seiken.co.jp\/english\/wp\/?page_id=148"},"modified":"2025-08-24T19:30:32","modified_gmt":"2025-08-24T10:30:32","slug":"fine_pitch","status":"publish","type":"page","link":"https:\/\/www.seiken.co.jp\/english\/products\/ic_sockets\/fine_pitch\/","title":{"rendered":"Fine-Pitch IC Sockets"},"content":{"rendered":"<section id=\"about\" class=\"container\">\n<h2>Fine-pitch Solutions for Next-Generation Electronics<\/h2>\n<div class=\"column2 -img2\">\n<div class=\"txt_wrap\">\n<p>As devices continue to shrink and packing density increases, the demand for high-performance fine-pitch testing solutions has never been greater. Seiken\u2019s fine-pitch IC sockets are built to meet this challenge\u2014empowering engineers and manufacturers to test the most compact, complex devices with confidence. <br \/>At the heart of our solution is Seiken\u2019s tubeless probe technology, engineered to support pitches as fine as 130\u03bcm. This breakthrough design delivers robust, reliable contact while maintaining exceptional mechanical strength, even the most demanding applications of modern testing environments.<br \/>Our fine-pitch IC sockets are an essential tool for the development and testing of cutting-edge electronics. If you\u2019re facing challenges with fine-pitch testing, we\u2019re here to help.<\/p>\n<\/p><\/div>\n<div class=\"img_wrap column2\">\n<figure>\n            <img decoding=\"async\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/themes\/wp-seiken-en\/assets\/images\/products\/ic_sockets\/fine_pitch\/about_img01.jpg\" alt=\"Fine-Pitch IC Sockets\"><br \/>\n          <\/figure>\n<figure>\n            <img decoding=\"async\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/themes\/wp-seiken-en\/assets\/images\/products\/ic_sockets\/fine_pitch\/about_img02.jpg\" alt=\"Fine-Pitch IC Sockets\"><br \/>\n          <\/figure>\n<\/p><\/div>\n<\/p><\/div>\n<div class=\"btn_wrap\">\n        <a href=\"..\/..\/probe\/fine_pitch\/\" class=\"btn\">Learn More About Fine-Pitch Technology<\/a>\n      <\/div>\n<\/section>\n<div class=\"anchor\">\n<ul class=\"anchor_list container\">\n<li><a href=\"#feature\">Key Features &#038; Advantages<\/a><\/li>\n<li><a href=\"#usage\">Application Examples<\/a><\/li>\n<li><a href=\"#cases\">Custom solution examples<\/a><\/li>\n<li><a href=\"#related_products\">Related Products<\/a><\/li>\n<\/ul><\/div>\n<section id=\"feature\" class=\"container\">\n<h2>Key Features &#038; Advantages<\/h2>\n<div class=\"box -border\">\n<h3>01 Designed for fine-pitch performance<\/h3>\n<div class=\"column2\">\n<div class=\"txt_wrap\">\n<p>Our sockets are fully customizable to meet non-magnetic, custom mechanical, and other specific requirements, ensuring consistent performance across a broad range of specialized conditions.<\/p>\n<\/p><\/div>\n<figure><img decoding=\"async\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/themes\/wp-seiken-en\/assets\/images\/products\/ic_sockets\/fine_pitch\/feature_img01.jpg\" alt=\"\"><figcaption>Pin Layout with 130\u03bcm Pitch<\/figcaption><\/figure>\n<\/p><\/div>\n<\/p><\/div>\n<div class=\"box -border\">\n<h3>02 Flexible production from one unit<\/h3>\n<p>Whether you&#8217;re prototyping a new device or moving toward production, Seiken offers flexible, low-volume<br \/>\n          manufacturing starting from just one unit. Our in-house engineering and production teams deliver tailored<br \/>\n          solutions with speed and precision\u2014exactly when and how you need them.<\/p>\n<\/p><\/div>\n<\/section>\n<section id=\"usage\" class=\"container\">\n<div class=\"ttl_link\">\n<h2>Application Examples<\/h2>\n<p>        <a href=\"..\/..\/industry_category\/\" class=\"link\"><span>Explore more <\/span><\/a>\n      <\/div>\n<div class=\"column2\">\n<figure class=\"-border\">\n<div><img decoding=\"async\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/themes\/wp-seiken-en\/assets\/images\/products\/ic_sockets\/fine_pitch\/usage_img01.jpg\" alt=\"\"><\/div>\n<\/figure>\n<div class=\"txt_wrap\">\n<ul class=\"list -dotted\">\n<li>Fine-pitch chips<\/li>\n<li>Discrete components, among others<\/li>\n<\/ul><\/div>\n<\/p><\/div>\n<\/section>\n","protected":false},"excerpt":{"rendered":"<p>Fine-pitch Solutions for Next-Generation Electronics As devices continue to shrink and packing density increas [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":44,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"page-products-child.php","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-148","page","type-page","status-publish","hentry"],"aioseo_notices":[],"acf":[],"_links":{"self":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/pages\/148","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/comments?post=148"}],"version-history":[{"count":0,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/pages\/148\/revisions"}],"up":[{"embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/pages\/44"}],"wp:attachment":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/media?parent=148"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}