{"id":663,"date":"2025-12-23T18:09:21","date_gmt":"2025-12-23T09:09:21","guid":{"rendered":"https:\/\/www.seiken.co.jp\/english\/?p=663"},"modified":"2025-12-24T13:15:17","modified_gmt":"2025-12-24T04:15:17","slug":"sip-and-zip-a-complete-package-guide-from-basics-to-inspection","status":"publish","type":"post","link":"https:\/\/www.seiken.co.jp\/english\/news\/663\/","title":{"rendered":"SIP and ZIP: A Complete Package Guide from Basics to Inspection"},"content":{"rendered":"\n<h3 class=\"wp-block-heading\">~An illustrated guide that makes semiconductor packages easy to understand at a glance~<\/h3>\n\n\n\n<p>SIP and ZIP are semiconductor packages. Semiconductor packages are broadly classified into <strong>through-hole packages<\/strong> and <strong>surface-mount packages<\/strong>.<br>Through-hole packages insert pins into through-holes in a board and secure them by soldering. Compared with today\u2019s surface-mount technologies, this is a more classical technique. Nevertheless, through-hole packages remain firmly used for:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Applications requiring high mechanical strength<\/li>\n\n\n\n<li>Components that carry large currents<\/li>\n\n\n\n<li>Educational and experimental circuits (breadboard-compatible)<\/li>\n<\/ul>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"683\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/ChatGPT-Image-Dec-23-2025-01_49_41-PM-1024x683.png\" alt=\"Semiconductor Packages\" class=\"wp-image-664\" style=\"aspect-ratio:1.4992860651486386;width:615px;height:auto\" srcset=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/ChatGPT-Image-Dec-23-2025-01_49_41-PM-1024x683.png 1024w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/ChatGPT-Image-Dec-23-2025-01_49_41-PM-300x200.png 300w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/ChatGPT-Image-Dec-23-2025-01_49_41-PM-768x512.png 768w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/ChatGPT-Image-Dec-23-2025-01_49_41-PM.png 1536w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n<\/div>\n\n\n<p>Historically important through-hole packages include <strong>SIP\/ZIP<\/strong> (single-row), <strong>DIP<\/strong> (dual in-line), and <strong>PGA<\/strong> (grid array with many pins). Below we explain each of them and how they relate to fixtures and contact probes used in inspection and test processes.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>SIP and ZIP \u2014 The origin of the mounting-density improvements pioneered by single-row packages<\/strong><\/h2>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>The birth of single-row packages<\/strong><\/h4>\n\n\n\n<p>SIP and ZIP are through-hole packages that grew from the very simple idea of arranging pins in a single row. Before surface-mount technology existed, they played an important role in increasing circuit scale within limited board area.<\/p>\n\n\n\n<p><strong>\u3000\u3000\u3000\u3000\u3000\u3000\u30fbSIP<\/strong>: pins in a straight line    \u3000\u3000\u3000   \u30fb<strong>ZIP<\/strong>: pins arranged in a zigzag pattern<\/p>\n\n\n\n<p>Although structurally similar, they differ clearly in how they approached higher density.<\/p>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>SIP (Single In-line Package)<\/strong><\/h4>\n\n\n\n<p>SIP is a long, narrow package with leads arranged in a single vertical row on one side. Its characteristics include:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Relatively high mounting density<\/li>\n\n\n\n<li>Intuitive layout and easy for prototyping<\/li>\n\n\n\n<li>Suited to designs that have allowance in the height (z) direction<\/li>\n<\/ul>\n\n\n\n<p>Historically used for:<\/p>\n\n\n\n<p>\u3000\u3000\u3000\u30fbResistor arrays\u3000\u3000\u3000\u30fbSensor ICs\u3000\u3000\u3000\u30fbSmall analog modules<\/p>\n\n\n\n<p>Today SIPs are less common in the general market, but they are still used in industrial applications that require elongated modules.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"680\" height=\"413\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/SIP.png\" alt=\"SIP package\" class=\"wp-image-669\" style=\"width:422px;height:auto\" srcset=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/SIP.png 680w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/SIP-300x182.png 300w\" sizes=\"auto, (max-width: 680px) 100vw, 680px\" \/><\/figure>\n<\/div>\n\n\n<h4 class=\"wp-block-heading\"><strong>ZIP (Zigzag In-line Package)<\/strong><\/h4>\n\n\n\n<p>ZIP is a<strong> higher-density <\/strong>improvement on SIP. ZIP shortens package length while effectively increasing neighboring pin spacing by bending pins into a zigzag arrangement.<\/p>\n\n\n\n<p>When ZIP first appeared it was a key package to cope with rapidly increasing memory integration.By reducing the mounting area:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Widely adopted for memory ICs, especially DRAM<\/li>\n\n\n\n<li>Can have a smaller footprint than DIP<\/li>\n\n\n\n<li>Able to meet demands for increased pin counts<\/li>\n<\/ul>\n\n\n\n<p>Recently modern high-density packages like BGA have largely replaced ZIP, so ZIP today is limited to narrower uses such as analog ICs or some power modules.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"640\" height=\"481\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/ZIP.png\" alt=\"ZIP package\" class=\"wp-image-670\" style=\"width:402px;height:auto\" srcset=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/ZIP.png 640w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/ZIP-300x225.png 300w\" sizes=\"auto, (max-width: 640px) 100vw, 640px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><strong>Technical pros and cons of SIP and ZIP<\/strong><\/h2>\n\n\n\n<figure class=\"wp-block-flexible-table-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><th><strong>Advantages<\/strong><\/th><td><strong>Disadvantages<\/strong><\/td><\/tr><tr><th>Simple structure, easy to manufacture<\/th><td>Requires height, so unsuitable for thin\/low-profile designs<\/td><\/tr><tr><th>Leads are robust; high mechanical strength<\/th><td>Physical limits to high pin counts (SIP\/ZIP have significant physical constraints)<\/td><\/tr><tr><th>Easy to repair\/replace \u2014 ideal for education<\/th><td>Lower mounting density compared with surface-mount technologies<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Fixtures required in inspection and test processes<\/strong><\/h2>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>Inspection characteristics for SIP and ZIP<\/strong><\/h4>\n\n\n\n<p>Because of their elongated shape and single-row pins, <em>lead parallelism<\/em> and <em>contact stability<\/em> strongly affect inspection accuracy. Therefore:<\/p>\n\n\n\n<figure class=\"wp-block-flexible-table-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td style=\"border-color:#ffffff\">\u30fbSIP-dedicated IC sockets<\/td><td style=\"border-color:#ffffff\">\u30fbContact blocks using vertical probes<\/td><\/tr><tr><td style=\"border-color:#ffffff\">\u30fbZIP deep-insertion type sockets<\/td><td style=\"border-color:#ffffff\">\u30fbManual fixtures (with insertion guides)<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>At Seiken, we can meet inspection requirements such as:<\/p>\n\n\n\n<figure class=\"wp-block-flexible-table-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><th><strong>Challenge<\/strong><\/th><td><strong>Example solutions from Seiken<\/strong><br><sub>*Click on each solution to learn more.<\/sub><\/td><\/tr><tr><th>Ensuring contact stability for long, narrow packages<\/th><td><a href=\"https:\/\/www.seiken.co.jp\/english\/products\/probe\/\" title=\"\">Customized spring probes and fixtures<\/a><\/td><\/tr><tr><th>Multiple contact points on narrow-pitch ZIP<\/th><td><a href=\"https:\/\/www.seiken.co.jp\/english\/products\/probe\/custom_products\/\" title=\"\">Fine-diameter, low-force probes<\/a><\/td><\/tr><tr><th>Integration into automated inspection lines<\/th><td><a href=\"https:\/\/www.seiken.co.jp\/english\/products\/test_fixtures\/probe_holder\/\" title=\"\">Probe blocks integrated with fixtures<\/a><\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>ZIP in particular can have cases where pin angles are slightly off; highly compliant spring probes are effective in following such variations.<\/p>\n\n\n\n<p>SIP and ZIP are classical compared with today\u2019s high-density packages, but they are historically important packages that supported the early stages of mounting-density improvements. There remains steady demand\u2014especially in industrial applications\u2014and their inspection often encounters contact issues caused by lead variability and narrow pitch.<\/p>\n\n\n\n<p>If you are experiencing problems in your inspection process, such as <strong>unstable contacts<\/strong> or <strong>yield not improving with current fixtures<\/strong>, please feel free to <a href=\"https:\/\/www.seiken.co.jp\/english\/contact_us\/\" title=\"\">contact us.<\/a> <\/p>\n\n\n\n<p>We can help you build an optimal inspection environment.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"995\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/\u753b\u50cf5-1024x995.png\" alt=\"SIP and ZIP are types of semiconductor device packages.\" class=\"wp-image-680\" srcset=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/\u753b\u50cf5-1024x995.png 1024w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/\u753b\u50cf5-300x291.png 300w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/\u753b\u50cf5-768x746.png 768w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/\u753b\u50cf5-1536x1492.png 1536w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2025\/12\/\u753b\u50cf5-2048x1990.png 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n","protected":false},"excerpt":{"rendered":"<p>~An illustrated guide that makes semiconductor packages easy to understand at a glance~ SIP and ZIP are semico [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[1],"tags":[],"class_list":["post-663","post","type-post","status-publish","format-standard","hentry","category-uncategorized"],"aioseo_notices":[],"acf":[],"_links":{"self":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/posts\/663","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/comments?post=663"}],"version-history":[{"count":10,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/posts\/663\/revisions"}],"predecessor-version":[{"id":681,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/posts\/663\/revisions\/681"}],"wp:attachment":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/media?parent=663"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/categories?post=663"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/tags?post=663"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}