{"id":683,"date":"2026-01-27T11:38:13","date_gmt":"2026-01-27T02:38:13","guid":{"rendered":"https:\/\/www.seiken.co.jp\/english\/?p=683"},"modified":"2026-01-27T11:38:16","modified_gmt":"2026-01-27T02:38:16","slug":"dip%e3%83%bbpga-understanding-package-structures-and-how-to-test-them","status":"publish","type":"post","link":"https:\/\/www.seiken.co.jp\/english\/news\/683\/","title":{"rendered":"DIP\u30fbPGA: Understanding Package Structures and How to Test Them"},"content":{"rendered":"\n<h3 class=\"wp-block-heading\"><strong>\uff5eFrom SIP to Ceramic Packages \u2013 Practical Guide to Legacy IC Packaging\uff5e<\/strong><\/h3>\n\n\n\n<p>DIP\u30fbPGA are classic examples of through-hole semiconductor packages, a packaging technology that has supported the evolution of electronic devices for decades. Semiconductor packages are generally classified into through-hole mounting and surface-mount mounting, with through-hole technology representing the traditional and highly reliable approach.<\/p>\n\n\n\n<p>In through-hole mounting, component leads are inserted into drilled holes on a printed circuit board (PCB) and soldered in place. Typical through-hole packages include SIP\/ZIP, DIP, and PGA. This article outlines the structural characteristics of DIP\u30fbPGA packages and introduces the test fixtures and contact probe technologies used to ensure reliable inspection and evaluation.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"684\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/collage-2pack-B.png\" alt=\"Semiconductor Packages\" class=\"wp-image-684\" srcset=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/collage-2pack-B.png 1024w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/collage-2pack-B-300x200.png 300w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/collage-2pack-B-768x513.png 768w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><strong>DIP\u30fbPGA \u2014 Cornerstones of Through-Hole Packaging<\/strong> <strong>When Through-Hole Packages Defined an Era<\/strong><\/h2>\n\n\n\n<p>DIP and PGA packages were developed to accommodate higher pin counts and support increasingly sophisticated integrated circuits.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>DIP: Two parallel rows of pins extending from both sides of the package<\/li>\n\n\n\n<li>PGA: Pins arranged in a dense grid pattern on the bottom surface<\/li>\n<\/ul>\n\n\n\n<p>These packages were widely adopted in electronic products throughout the 1980s and 1990s and remain familiar components in university laboratories and industrial test environments.<\/p>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>DIP (Dual In-line Package)<\/strong><\/h4>\n\n\n\n<p>DIP is the most widely recognized through-hole package, featuring two straight rows of leads along the long edges of the package. Several variations exist to meet different application requirements:<\/p>\n\n\n\n<figure class=\"wp-block-flexible-table-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><td style=\"border-color:#ffffff\">\u30fbPDIP (Plastic DIP)<\/td><td style=\"border-color:#ffffff\">\u30fbSDIP (Slim DIP)<\/td><\/tr><tr><td style=\"border-color:#ffffff\">\u30fbCDIP (Ceramic DIP)<\/td><td style=\"border-color:#ffffff\">\u30fbWDIP (Window DIP for EPROMs<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>DIP packages remained popular for many years due to their ease of manual soldering, mechanical robustness, and compatibility with breadboards and sockets. Today, they are still commonly used in:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Logic ICs (e.g., 74-series)<\/li>\n\n\n\n<li>Analog ICs (operational amplifiers)<\/li>\n\n\n\n<li>EPROMs and early-generation microcontrollers<\/li>\n<\/ul>\n\n\n\n<p>Their continued use spans education, industrial equipment, and maintenance-oriented systems.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"514\" height=\"418\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/DIP.png\" alt=\"DIP package\" class=\"wp-image-685\" style=\"aspect-ratio:1.2296820053193758;width:312px;height:auto\" srcset=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/DIP.png 514w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/DIP-300x244.png 300w\" sizes=\"auto, (max-width: 514px) 100vw, 514px\" \/><\/figure>\n<\/div>\n\n\n<h4 class=\"wp-block-heading\"><strong>PGA (Pin Grid Array)<\/strong><\/h4>\n\n\n\n<p>High Pin Counts with Grid-Style Precision, PGA packages place a large number of pins in a grid array on the underside, enabling significantly higher pin counts than DIP. This structure made PGA ideal for high-performance devices such as CPUs.<\/p>\n\n\n\n<p>Notable applications include processors from Intel (Socket 7, Socket 370) and AMD (K6, Athlon).<\/p>\n\n\n\n<p> <strong>Key characteristics<\/strong>:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Support for very high pin counts<\/li>\n\n\n\n<li>Excellent electrical performance<\/li>\n\n\n\n<li>Keying pins to prevent incorrect insertion<\/li>\n<\/ul>\n\n\n\n<p>While many PGA applications have transitioned to BGA (Ball Grid Array), ceramic PGA packages are still used in high-reliability servers, industrial systems, and mission-critical equipment.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"640\" height=\"441\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/PGA.png\" alt=\"PGA package\" class=\"wp-image-686\" style=\"aspect-ratio:1.4512758368498209;width:362px;height:auto\" srcset=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/PGA.png 640w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/PGA-300x207.png 300w\" sizes=\"auto, (max-width: 640px) 100vw, 640px\" \/><\/figure>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\"><strong>Technical pros and cons of DIP\u30fbPGA<\/strong><\/h2>\n\n\n\n<figure class=\"wp-block-flexible-table-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><th><strong>Advantages<\/strong><\/th><td><strong>Disadvantages<\/strong><\/td><\/tr><tr><th>Easy repair and replacement<\/th><td>Low mounting density; requires larger PCB area<\/td><\/tr><tr><th>Compatible with sockets for repeated insertion and removal<\/th><td>Not suitable for high-speed or high-frequency signal transmission<\/td><\/tr><tr><th>Supports high pin counts (especially PGA)<\/th><td>Large package size, limiting use in compact or mobile devices<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Fixtures required in inspection and test processes<\/strong><\/h2>\n\n\n\n<p>As pin counts increase, stable and reliable electrical contact becomes critical during inspection and testing. Typical fixtures and probing solutions include:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Probe fixtures for short\/open testing<\/li>\n\n\n\n<li>Evaluation boards with high-durability sockets<\/li>\n\n\n\n<li>Probe blocks for simultaneous multi-point contact<\/li>\n\n\n\n<li>Spring probes to minimize contact resistance<\/li>\n\n\n\n<li>Integrated socket-type fixtures for automated handling<\/li>\n<\/ul>\n\n\n\n<p><strong>Seiken\u2019s Solutions for Through-Hole Package Testing<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-flexible-table-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><th><strong>Challenge<\/strong><\/th><td><strong>Example solutions from Seiken<\/strong><br><sub>*Click on each solution to learn more.<\/sub><\/td><\/tr><tr><th>Fast manual testing of DIP<\/th><td>Socket + spring-<a href=\"https:\/\/www.seiken.co.jp\/english\/products\/test_fixtures\/\" title=\"\">probe fixtures<\/a><\/td><\/tr><tr><th>Stable contact for high-pin-count PGA<\/th><td><a href=\"https:\/\/www.seiken.co.jp\/english\/products\/test_fixtures\/probe_holder\/\" title=\"\">Pin blocks<\/a> \/ <a href=\"https:\/\/www.seiken.co.jp\/english\/products\/probe\/bias\/\" title=\"\">Bias probes<\/a><\/td><\/tr><tr><th>Evaluation under high-temperature conditions<\/th><td><a href=\"https:\/\/www.seiken.co.jp\/english\/products\/probe\/heat_resistance\/\" title=\"\">Heat-resistant probe solutions<\/a><\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>Because PGA grid pins are highly sensitive to deformation, precise probe load balancing is essential to maintain repeatable and reliable test results.<\/p>\n\n\n\n<p>Despite the rise of surface-mount technology, DIP\u30fbPGA packages continue to play important roles in education, industrial electronics, and high-reliability applications. As pin counts increase, challenges such as unstable contact, pin deformation, and fixture mismatch become more prominent.<\/p>\n\n\n\n<p>If you are experiencing testing issues or wish to optimize your inspection environment, Seiken offers tailored fixture and probe solutions designed for your specific requirements.<br>Please feel free to<a href=\"https:\/\/www.seiken.co.jp\/english\/contact_us\/\" title=\"\"> contact us<\/a>\u2014we are committed to supporting accurate, efficient, and reliable semiconductor testing.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"988\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/Packages-DIPPGA-1024x988.png\" alt=\"DIP\u30fbPGA are types of semiconductor device packages.\" class=\"wp-image-687\" srcset=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/Packages-DIPPGA-1024x988.png 1024w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/Packages-DIPPGA-300x289.png 300w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/Packages-DIPPGA-768x741.png 768w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/Packages-DIPPGA-1536x1482.png 1536w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/01\/Packages-DIPPGA-2048x1975.png 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n","protected":false},"excerpt":{"rendered":"<p>\uff5eFrom SIP to Ceramic Packages \u2013 Practical Guide to Legacy IC Packaging\uff5e DIP\u30fbPGA are classic examples of throug [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[1],"tags":[],"class_list":["post-683","post","type-post","status-publish","format-standard","hentry","category-uncategorized"],"aioseo_notices":[],"acf":[],"_links":{"self":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/posts\/683","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/comments?post=683"}],"version-history":[{"count":3,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/posts\/683\/revisions"}],"predecessor-version":[{"id":690,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/posts\/683\/revisions\/690"}],"wp:attachment":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/media?parent=683"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/categories?post=683"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/tags?post=683"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}