{"id":833,"date":"2026-08-20T14:15:03","date_gmt":"2026-08-20T05:15:03","guid":{"rendered":"https:\/\/www.seiken.co.jp\/english\/?p=833"},"modified":"2026-08-20T14:17:26","modified_gmt":"2026-08-20T05:17:26","slug":"twhm-2026-buzmic-a-new-approach-to-semiconductor-wafer-evaluation","status":"publish","type":"post","link":"https:\/\/www.seiken.co.jp\/english\/news\/1211\/","title":{"rendered":"TWHM 2026 | Buzmic: A New Approach to Semiconductor Wafer Evaluation"},"content":{"rendered":"\n<h3 class=\"wp-block-heading has-text-align-center\"><strong>Faster Wafer Characterization for Semiconductor R&amp;D<\/strong><\/h3>\n\n\n\n<p>TWHM 2026 (16th Topical Workshop on Heterostructure Microelectronics) will be held from Monday, August 24 to Thursday, August 27, 2026, at Hotel Ichibata in Matsue, Shimane Prefecture, Japan. Seiken will participate in the event and showcase Buzmic, a semiconductor wafer evaluation system designed for electrical characterization.<\/p>\n\n\n\n<p>Since its establishment in 1994, TWHM has brought together researchers and engineers working on microelectronics based on semiconductor heterostructures. The workshop provides a forum for sharing the latest research and technological developments in areas including semiconductor materials and evaluation, device physics, process technology, circuit design, and system applications.<\/p>\n\n\n\n<p>TWHM 2026 will cover a broad range of advanced semiconductor technologies, including heterostructure materials, Group III nitride semiconductors such as GaN, high-frequency, high-speed and THz devices, power electronics, sensors, manufacturing technologies, and reliability.<\/p>\n\n\n\n<p>At this year&#8217;s event, Seiken will introduce Buzmic (Semiconductor Carrier Analyzer), an advanced system for evaluating the electrical properties of semiconductor wafers.<\/p>\n\n\n\n<figure class=\"wp-block-flexible-table-block-table\"><table class=\"has-fixed-layout\"><tbody><tr><th style=\"width:25%\">Event<\/th><td><strong>16th Topical Workshop on Heterostructure Microelectronics \u2014 TWHM 2026<\/strong><\/td><\/tr><tr><th style=\"width:25%\">Dates<\/th><td><strong>Monday, August 24 \u2013 Thursday, August 27, 2026<\/strong><\/td><\/tr><tr><th style=\"width:25%\">Venue<\/th><td><strong>Hotel Ichibata, Matsue, Shimane Prefecture, Japan<\/strong><\/td><\/tr><tr><th style=\"width:25%\">Booth Number<\/th><td><strong>Exhibition Hall \u201cHeian,\u201d 2nd Floor, No. 7<\/strong><\/td><\/tr><tr><th style=\"width:25%\">Official Website<\/th><td><strong><a href=\"https:\/\/twhm.site\/\" title=\"\">TWHM 2026<\/a><\/strong><\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>Buzmic: Advanced Electrical Characterization of Semiconductor Wafers<\/strong><\/h4>\n\n\n\n<p>In semiconductor research and development, understanding the electrical properties of semiconductor wafers is essential for evaluating materials, optimizing manufacturing processes, and developing next-generation devices.<\/p>\n\n\n\n<p>This is particularly important for wide-bandgap semiconductors such as GaN, where parameters including <strong>sheet resistance, carrier concentration, and carrier mobility<\/strong> provide valuable insight into material properties and process conditions.<\/p>\n\n\n\n<p>Buzmic provides researchers and engineers with a practical approach to semiconductor wafer electrical characterization, helping them obtain important electrical-property data efficiently during R&amp;D and process evaluation.<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"alignright size-large is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"1358\" height=\"905\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/Buzmic-Logo-edited.png\" alt=\"Buzmic\" class=\"wp-image-836\" style=\"aspect-ratio:1.500535938401374;width:320px;height:auto\" srcset=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/Buzmic-Logo-edited.png 1358w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/Buzmic-Logo-edited-300x200.png 300w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/Buzmic-Logo-edited-1024x682.png 1024w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/Buzmic-Logo-edited-768x512.png 768w\" sizes=\"auto, (max-width: 1358px) 100vw, 1358px\" \/><\/figure>\n<\/div>\n\n\n<h4 class=\"wp-block-heading\"><strong>Evaluate Semiconductor Wafers Without Forming Metal Electrodes<\/strong><\/h4>\n\n\n\n<p>Conventional four-point probe measurements and Hall measurements often require the formation of metal electrodes on the measurement sample. This additional preparation can increase measurement time and complicate the evaluation process.<\/p>\n\n\n\n<p>Buzmic enables both <strong>four-point probe measurements and Hall measurements without forming metal electrodes<\/strong> on the wafer. By simplifying sample preparation, Buzmic can efficiently evaluate key semiconductor parameters such as sheet resistance, carrier concentration, and carrier mobility.<\/p>\n\n\n\n<p>This makes Buzmic particularly useful for semiconductor material research, wafer evaluation, and process development, where rapid and flexible electrical characterization can support faster R&amp;D cycles.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>See Buzmic in Action at TWHM 2026<\/strong>!<\/h2>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"321\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/Machine-buz-1024x321.png\" alt=\"Buzmic\" class=\"wp-image-837\" srcset=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/Machine-buz-1024x321.png 1024w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/Machine-buz-300x94.png 300w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/Machine-buz-768x241.png 768w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/Machine-buz.png 1536w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n<\/div>\n\n\n<p>At TWHM 2026, Seiken will showcase Buzmic to researchers and engineers working on advanced semiconductor materials and devices.<\/p>\n\n\n\n<p>If you are looking for a more efficient way to:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Characterize semiconductor wafers without forming metal electrodes<\/li>\n\n\n\n<li>Measure sheet resistance, carrier concentration, and carrier mobility<\/li>\n\n\n\n<li>Streamline electrical characterization during semiconductor R&amp;D<\/li>\n<\/ul>\n\n\n\n<p>we invite you to visit the Seiken booth and discover how Buzmic can support your semiconductor wafer evaluation needs.<\/p>\n\n\n\n<p>Seiken has developed semiconductor contact probes, inspection technologies, and evaluation solutions for many years. By combining this expertise with Buzmic, we aim to support researchers and engineers working on the development of next-generation semiconductor materials and devices.<\/p>\n\n\n\n<p>If you are attending TWHM 2026, please visit Seiken at Exhibition Hall \u201cHeian,\u201d 2nd Floor, Booth No. 7.<\/p>\n\n\n\n<p>For inquiries about semiconductor wafer evaluation, electrical characterization, Hall measurements,  <a href=\"https:\/\/www.seiken.co.jp\/english\/contact_us\/\" title=\"\">please feel free to contact us<\/a>.<\/p>\n\n\n\n<p>Explore a New Approach to Semiconductor Wafer Evaluation with Buzmic.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"439\" src=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/TWHM2026-1024x439.png\" alt=\"TWHM 2026\" class=\"wp-image-838\" srcset=\"https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/TWHM2026-1024x439.png 1024w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/TWHM2026-300x129.png 300w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/TWHM2026-768x329.png 768w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/TWHM2026-1536x659.png 1536w, https:\/\/www.seiken.co.jp\/english\/wp\/wp-content\/uploads\/2026\/08\/TWHM2026-2048x878.png 2048w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n","protected":false},"excerpt":{"rendered":"<p>Faster Wafer Characterization for Semiconductor R&amp;D TWHM 2026 (16th Topical Workshop on Heterostructure Mi [&hellip;]<\/p>\n","protected":false},"author":5,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[1],"tags":[],"class_list":["post-833","post","type-post","status-publish","format-standard","hentry","category-uncategorized"],"aioseo_notices":[],"acf":[],"_links":{"self":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/posts\/833","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/users\/5"}],"replies":[{"embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/comments?post=833"}],"version-history":[{"count":7,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/posts\/833\/revisions"}],"predecessor-version":[{"id":844,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/posts\/833\/revisions\/844"}],"wp:attachment":[{"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/media?parent=833"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/categories?post=833"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.seiken.co.jp\/english\/wp-json\/wp\/v2\/tags?post=833"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}