Customer Challenges / Request
As semiconductor devices continue to evolve, manufacturers are under pressure to deliver reliable products faster—and that means high-temperature load testing has become increasingly important.
However, conventional contact probes struggle under such demanding conditions due to several challenges:
- Narrower terminal pitch in compact device designs.
- Heat-related degradation of probe materials.
- Need for simultaneous multi-point measurements.
- Cost and efficiency requirements.
Existing solutions couldn't deliver the durability, precision, or scalability the customer needed for modern semiconductor testing environments.
Our Solution
To meet these requirements, Seiken engineered a high-temperature-resistant contact probe system:
- Heat-Resistant Internal Spring: We replaced conventional springs with a proprietary material that maintains strength and function at elevated temperatures.
- Advanced Plating: Applied a special surface treatment to prevent probe tip degradation due to thermal stress.
- Optimized Holder Materials: Chose low thermal expansion materials—like engineering plastics and machinable ceramics—for probe boards and housings, balancing performance and cost.
- Thermal-Aware Design: Used layout and structural design techniques to minimize the effects of expansion and contraction.
Results & Benefits
- High-Density Testing Enabled: Vertical probe design allows more probes in a smaller area, supporting simultaneous multi-point testing.
- High Temperatures Resistance: By independently selecting and applying optimal materials, components, and surface treatments, we developed contact probes highly resistant to thermal effects.
- Stable Performance at High Temperatures: Probes maintain mechanical shape and electrical integrity even under intense thermal conditions.
- Reduced Downtime: Probes are designed for easy replacement, lowering maintenance costs and boosting efficiency.
- Lower Self-Heating Impact: Our materials and design help minimize heat buildup from current flow during testing.
Application
This solution is ideal for high-temperature testing of discrete semiconductor devices—such as diodes and power semiconductors—using IC sockets, probe cards, or custom inspection fixtures.