Customer Challenges / Request
A domestic test house approached Seiken with a recurring issue:
Their client had provided overseas-made test probes, but these suffered from poor durability and required frequent replacement.
The test house wanted to localize production in Japan to improve quality and reduce dependency on foreign suppliers. However, several constraints existed:
- The probe housing would be reused, so external dimensions had to match the current design.
- The electrical current conditions were unknown, requiring a flexible and technically informed proposal.
Our Solution
Seiken drew on its material engineering and probe design expertise to create a solution optimized for real-world performance:
- We selected a special alloy for the probe tips, optimized for testing WLCSP packages with lead-free solder balls. This alloy offered Excellent electrical conductivity and Strong resistance to solder adhesion.
- To improve heat and stress resistance, we replaced the internal spring with a heat-resistant variant, ensuring stable probe actuation over a longer lifespan.
Results & Benefits
Lifespan Improved by 5 times: Compared to the previously used probes, our custom solution offered significantly greater durability. They fully matched external dimensions allowed integration into existing equipment.
Application
This solution is ideal for semiconductor back-end processes, where narrow-pitch probes must endure repetitive use and challenging materials like lead-free solder among others.
To further enhance performance, Seiken is actively working on:
- Extending lifespan even further through advanced materials.
- Optimizing housing design for better durability and easier integration.