News & Updates

SOP, SOJ, and SON Packages — An Easy Guide to Their Features and Inspection PointsNEW

TestConX 2026 – Join Us at Booth 71

DIP・PGA: Understanding Package Structures and How to Test Them

SIP and ZIP: A Complete Package Guide from Basics to Inspection

Bare Die (Dice): The Starting Point of Semiconductor Chips

Contact Probes Discontinued on MISUMI…

Silicon Wafer and Wafer Testing — The Frontline of Semiconductor Quality

Join Seiken at Productronica 2025!

Seiken to Showcase Inspection Solutions at PSECE 2025 in the Philippines!

Seiken Joins Kyushu’s Key Event for the Semiconductor Industry