News & Updates

electronica 2026: Bring Your Testing Challenge. Let’s Find the Solution Together.

PSECE 2026: Connect. Discover. Innovate.

3rd Semiconductor Technology Expo in Kyushu

TWHM 2026 | Buzmic: A New Approach to Semiconductor Wafer Evaluation

EMAX Asia 2026 | Discover Seiken’s Test Solutions

MCM, Flip-Chip, & Ceramic Packages: Inspection Challenges and Testing Solutions

CSP & WLCSP: Features, Testing, and Inspection

LGA ＆ BGA Packages: How They Work and What to Inspect

QFP, QFJ, & QFN Package Guide — Features and Key Inspection Points

SOP, SOJ, and SON Packages — An Easy Guide to Their Features and Inspection Points