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Fine pitch technology

Fine pitch is trend recently for various electronics components and in order to ensure reliability, stable contacting, high-precision probe is indispensable.

Semiconductor devices are smaller and smaller and required performance varies depending on the deference usage for the testing of Wafer Level Chip Scale Packaging (WL-CSP), Flip Chip and Copper Pillar.

Utilize our precision processing and assembly technology, we provide center pitch 150μ m vertical contact probes and are developing micro fine pitch vertical contact proves. We believe that we are able to introduce micro fine pitch contact probes in the future. For more information, please contact at

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We offer a wide variety of contact probes and receptacles on pitches ranging from 0.45mm to 2.54mm. Plunger tip styles can be provided in a variety of tip styles for our standard type contact probes. Receptacles are available with preassembled cable length 100mm or 300mm as option.Should you have any question or need more information, please contact at

Please click on your desired catalog for the following.

Custom-made contact probes are also available to meet your specifications and for more information, please contact at

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Head Office

10F, Techno-Port Mitsui Seimei Building, 2-16-2 Minamikamata Ota-ku, Tokyo, Japan, 144-0035 (MAP)

TEL 81-3-3734-1212Telephone reception service:

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