ProductsFine-Pitch Technology

In semiconductor testing, cantilever probes are typically used for wafer-level inspection, while IC socket methods using double-ended probes are common packaging testing. However, as chip mounting technology evolves, more devices now feature fine-pitch bumps or copper pillars directly on the chip, making traditional cantilever methods less effective. The extremely tight, grid-like bump layouts make it difficult to position probe tips accurately.
At the same time, the demand for simultaneous multi-device testing with uniform and fine-pitch contact is increasing. This has led to the growing use of vertical probe cards and other high-density testing solutions. Seiken addresses these challenges by offering fine-pitch probes tailored to your pitch requirements, along with customized fixtures and board designs, delivering a total solution for advanced test needs.