ProductsFine-Pitch Probe Card
Breaking Trough the Limits of Fine-Pitch Testing
As technology advances, the gap between front-end and back-end testing methods has closed. While cantilever probes were traditionally used for front-end testing, and contact probes for back-end testing, emerging devices like WL-CSP, Flip Chip, and Copper Pillar require more advanced solutions that cantilever probes alone cannot provide.
Seiken has redefined the standards of fine-pitch testing with our innovative contact probe card, capable of handling pitches as small as 130μm—going beyond the conventional advanced-type cards, which typically support pitches of 100μm or more.
Key Features & Advantages
01 Flexible grid layout
Our solution easily accommodates grid layouts and multi-contact designs, offering a level of versatility that traditional cantilever probes cannot match. Maintenance is also simplified, with easy probe replacements that improve efficiency and reduce downtime.
02 Ready for volume production
Whether you’re working with a single unit for prototyping or need larger-scale production, Seiken provides consistent quality, ensuring your testing needs are met at every stage.
Application Examples
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- WL-CSP
- FlipChip
- Copper Pillar