SEIKEN has been developing the following technologies.
Advanced prove card is suitable for contacting to electrodes of WL-CSP, Flip Chip and Copper Pillar. Attaching a frame guide and a cover for the probe card enables the same operation as IC test sockets.Advanced probe card & socket kits
Non-Magnetic probe cards are for sensor device test such as Hall IC, electronic compass and MR/MI sensors. We have developed highly non-magnetic probes and probe cards to realize higher customer needs.Non-Magnetic probe card & socket kits
SEIKEN provides support for Kelvin measurement to contact 2 points on one electrode by utilizing our own know-how and technologies.Kelvin probe card & socket kits
Designed specifically for testing power devices such as IGBT for automobile application, we have succeeded in developing our high current probe card by totally new approach.High current probe card
We are now challenging to develop an advanced probe card with the narrowest pitch to the limit.Fine-pitch probe card
We have secured various pins based on Test Probe Pin manufacture and we are able to satisfy the demand of the user by variety of line up of double plunger probe.IC Sockets
There are two tests for electrical testing of semiconductors. One is the wafer test in front-end process and the other is the final test in back-end process, which is conducted after packaging such as BGA, CSP and QFN.
The Probe Card is used for wafer test in front-end process. Seiken supplies various vertical probe cards which cultivated probe technology for many years.
We suggest probe cards in accordance with the inspection contents of the user such as IC shape like FC, WL-CSP, and test environment like non-magnetic, kelvin etc.
An IC test socket is used in the final test. IC test socket is categorized into two types、 test socket with spring probe type and the test socket with leaf spring type. SEIKEN provides a wide range of IC test sockets using spring contact probes.
Our IC test sockets have high precision housing by machining, variety of line-up of probe assembled and are conformity to various IC package such as BGA, CSP, SON, and QFP.